|
S
E R V I C E S
P
R O D U C T S
T
E CH N O L O G Y
S
U P P O R T
C
U S T O M E R S +
C
O O P E R A T I O N S
T
O O L S
A
B O U T
C O N
T A C T
Fon
+49-30-678 197 35 Fax
+49-30-678 197 34 Cell
+49-151-17333026 RL@RL-Design.de
|
|
|
SUBSTRATE
MATERIALS |
|
|
|
PCB
- CERAMIC - THINFILM - FLEX |
|
|
|
SUBSTRATE
TECHNOLOGIES |
|
|
|
THT
- SMT
- MICRO VIA - BUILT UP |
|
|
|
COMPONENTS |
|
|
|
BGA
- CHIP SIZE PACKAGE - SOP |
|
|
|
ASSEMBLY |
|
|
|
SMT
- CHIP
ON BOARD - FLIP CHIP |
|
|
|
ADVANCED
SYSTEM DESIGN |
|
|
|
MID
TECHNOLOGY - Si
ETCHING |
|
|